Thermal Design Engineer, Pixel | Chicago, IL

Detailed Information

  • Location: Chicago, IL

  • Company: Google

and collaborate with vendors and outside sources in order to see parts through to manufacture. As a Thermal Engineer, you will solve thermal problems creatively. You will model systems virtually and invent solutions. In this role, you will actively communicate with hardware and software teams to establish a design direction, create prototypes that prove it, and work to scale that prototype.

You will design products that satisfy all performance and reliability specifications and optimize efficiency, flexibility, and the total cost of ownership. The Google Pixel team focuses on designing and delivering the world's most helpful mobile experience. The team works on shaping the future of Pixel

devices and services through some of the most advanced designs, techniques, products, and experiences in consumer electronics. This includes bringing together the best of Google's artificial intelligence, software, and hardware to build global smartphones and create transformative experiences for users across the world.

The US base salary range for this full-time position is $139,000-$208,000 bonus equity benefits. Our salary ranges are determined by role, level, and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries for the position across all US locations. Within the range, individual pay is determined by work location and

additional factors, including job-related skills, experience, and relevant education or training.

Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Please note that the compensation details listed in US role postings reflect the base salary only, and do not include bonus, equity, or benefits. Learn more about benefits at Google. Minimum qualifications: Bachelor's degree in Mechanical Engineering or equivalent practical experience. 5 years of experience in design, analysis (i. e. thermal analysis), and shipping consumer hardware with thermal needs. Experience with 3D computer-aided design (CAD) systems (i.

e. Creo). Experience with Computational Fluid Dynamics (CFD) software (e. g. ICEPAK, Autodesk, Open FOAM, Flo THERM) or an equivalent software. Preferred qualifications: Master's degree in Mechanical Engineering with a focus on Thermal Science. Experience with devices and services, mobile, or consumer electronics devices. Knowledge of classical feedback control theory, dynamic system identification, and modeling/sensor interfacing. Knowledge of cooling strategies used at the package, board, and system levels with successful application of advanced cooling technologies. Knowledge of structural simulation tools (i.

e. Abaqus CAE or Hypermesh). Knowledge of design for medium to large-scale production using technologies such as sheet metal fabrication, injection molding, machining, and die casting. - Engage in development efforts related to thermally modeling small form factor computing devices with a variety of heat sources (i. e. chipsets, memory, screens, radios, and sensors). - Manage mechanical and thermal design including requirements gathering, concepts generation and detailed design, analysis and verification testing, cross-functional reviews, and manufacturing release.

- Engage in overall system architecture, making interdisciplinary trade-offs to optimize total cost of ownership (TCO) of designed solutions. Manage the thermal subsystem virtual model, create thermal systems, select thermal interface materials and thermal paths, and verification testing. - Architect and influence product design by providing mechanical/thermal engineering insight into the technology roadmap. Identify and scope projects around innovation opportunities and technology risks. - Work with internal manufacturing teams and external fabrication vendors during the product development lifecycle. Requisition #: 112991080565088966pca3lyuhf

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